A Study on the evaluation of sandwich busduct using temperature rise method

Abstract

Different types of busducts like Isolated Phase Busduct, Segregated and Non Segregated Busducts are used in Power Distribution Network which occupies voluminous, large space of the equipment. Recently, Sandwich Busducts have come into vogue because of their compactness, light weight, low impedance, and fire retardancy besides several other advantages. However Sandwich Busducts need to maintain high quality conductors, superior design, high dielectric withstand voltage. These properties would meet the requirements of electrical parameters but for the requirement of thermal specifications, it is Temperature rise method widely employed to monitor the thermal performance of Sandwich Busducts. In the present investigation, modular designed Sandwich Busducts are chosen and studied using Temperature rise method. The samples of Sandwich Busducts are subjected to Temperature rise method. The temperature at critical points of Sandwich Busducts are monitored and evaluated in the light of International Specifications. Of the many inferences derived, the important observations at thermal steady state for busduct, incoming and outgoing terminals have been obtained. The present paper focuses on assessing the components forming Sandwich Busduct for their evaluation to apply to field conditions in the Electrical Power System Network.