Investigation of Planar Antenna Performances on Commercially Available Dielectric Materials
##plugins.themes.academic_pro.article.main##
Abstract
Planar RF antennas with their conformal geometry, good RF performances and ease of construction find a wide range of applications ranging from mobile phones to RADAR and wearable electronic gadgets to medical implant devices. The selection of a suitable dielectric material is by far the most crucial step in the antenna design process to achieve the desired RF characteristics. The directivity, efficiency and bandwidth of an antenna depend on the substrate dielectric constant, loss tangent and material thickness. This paper investigates the RF performances of two planar antennas designed using two commercially available dielectric materials namely RT Duroid and FR4 with a full wave 3D EM simulation tool. The results show the superior RF characteristics of the antenna designed using RT Duroid over FR4. The antenna designed with RT Duroid substrate is fabricated and the measurement results obtained are found to be in good agreement with the simulation results.
##plugins.themes.academic_pro.article.details##
References
- Barshaw EJ, et al. High Energy Density (HED) Biaxially- Oriented Poly-Propylene (BOPP) capacitors for pulse power applications. IEEE Transactions on Magnetics. 2007; 43(1):223-5. https://doi.org/10.1109/TMAG.2006.887682 DOI: https://doi.org/10.1109/TMAG.2006.887682
- MacDougall F, et al. High energy density capacitors for pulsed power applications. 2009 IEEE Pulsed Power Conference, Washington, DC, USA. 2009; 774-8. https:// doi.org/10.1109/PPC.2009.5386359 DOI: https://doi.org/10.1109/PPC.2009.5386359
- Liu Y, Dong X, Du B, Gao Q. Influence of polarization and non-uniform electric field on failure characteristics of polypropylene film. IEEE Access. 2020; 8:74423-31. https:// doi.org/10.1109/ACCESS.2020.2988484 DOI: https://doi.org/10.1109/ACCESS.2020.2988484
- Zhang JH, Du BX, Xiao M, Liu HL, Chen K, Ran ZY. Evaluation of breakdown properties of polypropylene films under multiple stresses for DC capacitors. 2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE), Chongqing, China. 2022; 1-4. https://doi.org/10.1109/ICHVE53725.2022.9961711 DOI: https://doi.org/10.1109/ICHVE53725.2022.9961711
- Cheng L, Li Z, Wang J, Xu Z, Liu W, Li S. Degradation behavior and mechanism of metalized film capacitor under the ultrahigh field. IEEE Transactions on Dielectrics and Electrical Insulation. 2023; 30(2):509-17. https://doi. org/10.1109/TDEI.2023.3247991 DOI: https://doi.org/10.1109/TDEI.2023.3247991
- Li H et al. Electric field and temperature dependence of electrical conductivity in biaxially oriented polypropylene films. IEEE Transactions on Plasma Science. 2014; 42(11):3585-91. https://doi.org/10.1109/TPS.2014.2360893 DOI: https://doi.org/10.1109/TPS.2014.2360893
- Whitehead S. Dielectric Breakdown of Solids. London: Oxford University Press; 1951.
- Ritamäki M, Rytöluoto I, Lahti K. Performance metrics for a modern BOPP capacitor film. IEEE Transactions on Dielectrics and Electrical Insulation. 2019; 26(4):1229-37. https://doi.org/10.1109/TDEI.2019.007970 DOI: https://doi.org/10.1109/TDEI.2019.007970
- Thomas AJ, Reddy CC. Effect of nonlinear conduction on needle tip-plane breakdown fields under DC conditions. IEEE Transactions on Dielectrics and Electrical Insulation. 2021; 28(4):1101-9. https://doi.org/10.1109/ TDEI.2021.009272 DOI: https://doi.org/10.1109/TDEI.2021.009272
- Reddy CC, Ramu TS. On the computation of electric field and temperature distribution in HVDC cable insulation. IEEE Transactions on Dielectrics and Electrical Insulation. 2006; 13(6):1236-44. https://doi.org/10.1109/ TDEI.2006.258195 DOI: https://doi.org/10.1109/TDEI.2006.258195
- Dhayalan S, Reddy CC. Simulation of electro-thermal runaway and thermal limits of a loaded HVDC cable. IEEE Transactions on Power Delivery. 2022; 37(4):2621-8. https://doi.org/10.1109/TPWRD.2021.3112558 DOI: https://doi.org/10.1109/TPWRD.2021.3112558
- He Y, Wang F, Du G, Pan L, Wang K, Gerhard R, et al. Revisiting the thermal aging on the metalized polypropylene film capacitor: From device to dielectric film. High Voltage. 2022; 8(2):305-14. https://doi.org/10.1049/hve2.12278 DOI: https://doi.org/10.1049/hve2.12278